Heat Flux vs Temperature
, by Braeden Ostepchuk, 1 min reading time
What Really Matters for Palm Cooling
When evaluating or implementing palm cooling, it’s easy to get caught up in one number: temperature. But this focus misses the point. Temperature alone doesn’t determine how much cooling occurs. What really matters is heat flow.
Heat flux is what matters, not temperature.
Palm Cooling Analogy
Think of it like plumbing: temperature is the pressure behind the water, but flow is how much water actually moves. You could have the coldest surface in the world, but if there’s no sustained heat transfer from the body into that surface, either due to system heat capacity of availability of heat transfer (e.g. vasoconstriction) it won’t cool anything meaningfully.
Palm cooling must be designed and implemented to optimize the rate and volume of heat transferred from the body to the cooling interface over time. That means:
- Maintaining a strong thermal gradient (temperature difference between palm and cooling surface)
- Ensuring continuous or repeated contact with conductive material
- Using a device with sufficient thermal capacity to absorb and offload heat without warming up too quickly
Key Takeaway for Palm Cooling
The goal isn’t “how cold can we make the device?”
It’s “how effectively and consistently can we extract heat from the palm over the duration of use?”
Heat flux is the key metric. When heat moves efficiently, core temperature stabilizes, fatigue slows, and performance improves. When it doesn’t, even a cold device becomes irrelevant.
Optimize for flow. Not just feel.